Olympus Soft Imaging Solutions

	iTEM Family
	iTEM Platform iTEM CE iTEM Desktop archive FDA webRacer siViewer
	iTEM Solutions
	ASAC EFTEM Diffraction Tomography telePresence Detection EMarker Virology
	Side-mounted TEM cameras
	Veleta MegaView G2 Morada
	Bottom-mounted TEM cameras
	KeenView G2 Cantega G2
	Digital Scan Interface

The iTEM Solution ASAC (Automatic Strain Analysis by CBED) is an advanced tool for the TEM/CBED field and is for use with Olympus Soft Imaging Solutions' TEM imaging platform iTEM.

	Computation of HOLZ pattern models
	Computation of strain tensor and its trace with a precision of 2x10-4 for single TEM/CBED images and image series
	Automatic image processing, line detection and line indexing for the entire image stack

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Key Features

Specifications

Applications

The iTEM Solution ASAC (Automatic Strain analySIS by CBED) determines the strain in semi conductive devices automatically by image analysis. ASAC analyzes convergent beam electron diffraction TEM images of Si (130) and (230) acquired at 100keV and 200keV. The algorithm detects the HOLZ (High Ordered Laue Zone) lines automatically with high precision and the results can be obtained within a few minutes. The software calculates the effective voltage and the strain tensor and its trace. The strain values can be visualised as a coloured spot within an overview image or exported in a data sheet.

Overview of the functionality:

Automated acquisition of TEM/CBED patterns via a procedure, which can be routinely used by the microelectronics industry. A set of points along ROIs (regions of interest) in the cross-sectioned structure can be chosen and the electron probe will be sequentially located in each of them for the CBED pattern acquisition without requiring the operator’s control (only for LEO 912 and LEO 922 microscopes and supported cameras).
Automatic import of Emispec Series Data File Format image series (*.ser) acquired using FEI’s Tecnai Image Acquisition (TIA) system and export as multi-page TIF files.
Image and data archiving in a database for later research and higher productivity.
Image Processing and filtering in such a manner that individual line diffraction pattern may be automatically detected and mathematically represented. This includes computation of HOLZ pattern models to identify the relevant (strain sensitive) HOLZ lines.
Computation of the effective voltage in a TEM by comparison of simulated HOLZ pattern and experimentally achieved images on perfect silicon.
Computation of the strain tensor and its trace with a precision of 2x10-4 for single TEM/CBED images and for series of images acquired over an area of a semiconductor device.
Automatic image processing, line detection and line indexing for a complete image stack .
Storing all relevant image information including the strain tensor with the image.
2D-maps of strain distributions achieved by CBED-maps on e.g. STI structure.

Required Accessories: